- Design, Engineering, and E.C.O Support
- SMT, 6 lines
- Wave Soldering
- Press fit connectors insertion machine
- BGA, Ceramic BGA and Micro BGA capability
- BGA rework and Inspection capability
- Re-Balling of BGA components
- ROHS compliance
- Mechanical assembly (including boxes, harnesses, cables)
- ICT, J-Tag, Functional testing and testability design support
- 3D X-Ray for BGA quality
- ICT Fixture development and programming
- ESS and Burn-in